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MARTVIEW RB-01 BGA Reballing Platform

MARTVIEW RB-01 BGA Reballing Platform

PKR 0.00
PKR 0.00
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ID 8057431490742

Metal weight of heavy mass flat vector icon for apps and websites Weight : 0.25 kg

Shipment Delivery Time!

Shipment delivery time 2 to 5 business days.

 

NOTE! Shipment is generally processed within 1 business day after we received your payment in full.

 

NOTE! We only shipment orders from Monday to Saturday. Orders placed on the website on Fridays, Sundays, and certain declared holidays are processed the next business day.

 

NOTE! We do not bear responsibility for the delays in delivery by the delivery company. You may find information about the location of your package at the delivery service website.

 

NOTE! Shipment cost is not included in product price. They are calculated due to the pricing policies of the delivery companies. Please note: the shipping rates are weight-based. The weight of every item is indicated on its product page. 

Shipment Delivery Time!

Shipment delivery time 2 to 5 business days.

 

NOTE! Shipment is generally processed within 1 business day after we received your payment in full.

 

NOTE! We only shipment orders from Monday to Saturday. Orders placed on the website on Fridays, Sundays, and certain declared holidays are processed the next business day.

 

NOTE! We do not bear responsibility for the delays in delivery by the delivery company. You may find information about the location of your package at the delivery service website.

 

NOTE! Shipment cost is not included in product price. They are calculated due to the pricing policies of the delivery companies. Please note: the shipping rates are weight-based. The weight of every item is indicated on its product page. 

RB-01 Reballing Stencil Tin Net Full Set for EMMC / EMCP / UFS.

How it works

Advantages

  • High precision and precise alignment. Each mesh is calibrated according to the original factory drawings to ensure the accuracy of the solder joints.
  • Rigid and flexible, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape.
  • Silicone anti-slip foot pads are used at the bottom to effectively isolate the temperature, anti-skid, and anti-scald so that the tin planting position is more stable.
  • Double magnet ensures accurate positioning without shaking.

Features

  • Support for EMMC / EMCP / UFS:
    • BGA153, BGA162, BGA169, BGA186, BGA221, BGA254

Specifications

  • Fixing plate and holder included.
  • Stencil net thickness: 0.15 mm
  • Support IC size: 11.5 x 13 mm, 12 x 16 mm
  • Holder size: 80 x 80 x 15 mm
  • Packing size: 89 x 89 x 32 mm

Package Contents:

  • Stencils - 6 pcs.
  • Adjustment frame - 2 pcs.
  • Adjustment piece - 2 pcs.
  • Tin scraper - 1 pc.
  • Fixed plate - 1 pc.
  • Holder - 1 pc.
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